LEAD TIN POWDER T4
BANKAESA® Solder Powder Series is a high-quality solder material designed for use in electronics assembly. Excellent solder ability, low melting point, and reliable performance, making it ideal for a wide range of electronic applications. BANKAESA® Solder Powder is specifically designed for a wide range of electronic soldering applications, offering excellent performance in high-precision and high-density soldering processes. Its versatile use makes it an ideal solution for modern electronics assembly needs.
Physical Properties
Properties | Value Range | |
Appearance | Grey Powder | |
Specification | Type | Size |
| T3 | 25-45 µm |
| T4 | 20-38 µm |
| T5 | 15-25 µm |
| T6 | 5-15 µm |
To control the impurity content in the development and production of lead free alloy, espesialy to make sure lead (Pb) content bellow 300ppm, PT. Timah Industri is supported by high quality materials of Sn that Supplied by the company’s smelting and reliable laboratorium.
Application
STANDARD PACKAGING
✓ Net Weight: Powder is packaged in 10 kg
✓ Packaging Type: Airtight layered aluminium foil bags under inert gas to prevent oxidation. This system maintains
product purity and quality.
SAFETY & HANDLING
BANKAESA® Solder Powder Series may be handled with the same normal precautions as other solder powder product. Solder Powder should be handled with care by qualified personnel equipped with appropriate personal protective equipment, including mask, safety goggles, and protective clothing, to prevent direct contact and dust. The powder is reactive with oxidizing agents and can produce toxic gases, so it is crucial to avoid open flames and uncontrolled heat exposure. Store the product in a cool, dry area with a stable temperature between 5-30°C, ensuring that the packaging remains sealed immediately after each use to prevent moisture ingress and contamination. Always refer to the Material Safety Data Sheet (MSDS) for detailed safety and health information before handling.
